Amplia aplicación de material de enfriamiento de chips de nitruro de boro hexagonal -

A medida que los componentes y sistemas electrónicos se vuelven más pequeños y rápidos, el tratamiento térmico y la confiabilidad se convierten en cuestiones clave que afectan su longevidad. La gestión térmica del punto caliente local con alto flujo de calor es la clave de los dispositivos electrónicos de alta potencia.

Although graphene has a very high thermal conductivity (5300W/(m·K)), it was found in the experiment that the thickness of the silicon dioxide insulation layer on the chip surface would affect the heat dissipation effect of graphene. If the silicon dioxide layer is too thick, it will hinder the effective conduction of hot spot heat to the graphene layer; if the silicon dioxide layer is too thin, it is easy to make the metal circuit contact with the graphene layer and cause short circuit. Hexagonal boron nitride, as a material of both insulation and high thermal conductivity, will become the key material to improve the heat dissipation capacity of chips.